3D sensor chip and solution provider Adaps Photonics completed a C+ round funding

Time:2023-02-10
Recently, 3D sensor chip and solution provider Adaps Photonics completed a C+ round funding of 15 million USD, with investors including Stonevc and Spring Venture Capital, while Lighthouse Capital acted as the exclusive financial advisor.

Recently, 3D sensor chip and solution provider Adaps Photonics completed a C+ round funding of 15 million USD, with investors including Stonevc and Spring Venture Capital, while Lighthouse Capital acted as the exclusive financial advisor. Since its establishment in 2018, Adaps has completed several rounds of financing. With the completion of this new round of funding, it once again confirms Adaps Photonics' technological strength and future development potential in the dToF field, helping the company to further consolidate its technological advantages in the dToF field and expand business applications in various scenarios.

Adaps Photonics is one of the few companies in the world with mature 3D stacked dToF chip design and process capabilities. It has always been in the leading position in high PDE high-performance SPAD chip design and process capabilities, with PDE reaching 25% at the wavelength of 905nm. The company has applied for more than 100 domestic and international patents. In terms of product development, based on its profound understanding of the 3D vision market demand, the company has launched three major product series: silicon photomultiplier (SiPM), single photon imaging array (SPADIS) and dToF module, all-in-one dToF chip and module, which basically cover a wide range of 3D sensor applications such as automotive LiDAR and intelligent cockpit sensing systems, mobile phones, XR headsets, robots, intelligent home appliances, intelligent buildings, and so on. At present, the company's products have begun to be mass-produced and gradually introduced into downstream customer products such as automotive, consumer electronics, smart homes, and industrial products. Single-point products have already achieved mass production and shipment in consumer products such as hair dryers and mobile phones, while the SiPM products have completed the preparation for automotive regulations and quantity production.

dToF (direct Time of Flight) is a depth sensing technology solution mainly used for ranging and 3D imaging. It can directly emit light pulses to the object to be measured and capture reflected light pulses to calculate the distance of the object to be measured by recording the flight time of the light pulses. dToF has excellent ranging ability, high adaptability, low cost, low power consumption, and high reliability, which can meet the loading requirements of most common platforms from mobile phones to automobiles, and from household appliances to industry. In the foreseeable future, it will continue to exist as one of the mainstream depth sensing technologies.


 

Following consumer electronics, the automotive industry is expected to become an important market for the next wave of 3D sensor innovation, and Adaps Photonics is continuously exploring the application of dToF in automotive scenarios. The company has cooperated with many automotive industry partners and has taken the lead in laying out dToF in automotive LiDAR and DMS sensors, with commercialization progress in the forefront of the market. At present, the company's products have been evaluated by many LiDAR manufacturers and have been imported in small quantities. It has also formed strategic partnerships with many upstream and downstream enterprises in the automotive field to jointly promote the process of LiDAR in automobiles and accelerate the development of smart cars toward three-dimensional perception.

At the same time, Adaps Photonics is also accelerating its strategic layout for XR. As the market's interest in consumer-level XR devices and AR/VR applications on mobile phones is becoming increasingly strong, dToF technology, with its superior 3D imaging ability, is expected to promote the improvement of XR content and accelerate the popularity of consumer-level XR. In 2022, Adaps Photonics cooperated with Qualcomm and Arcsoft to mount the Adaps Photonics Spot dToF chip on the Snapdragon 8 Gen2 processor, successfully creating a new director "cinematic mode" on Android phones to easily achieve functions such as rapid focusing, complex lighting scene optimization, focus switching, and focus tracking, greatly improving the user's video shooting experience on Android phones. In the future, Adaps Photonics and its partners will further deepen the research and development of dToF in mobile phone chips while actively expanding the application of this technology in the XR field.

Next, Adaps Photonics will continue to conduct multiple product lines deep layout while accelerating the application of dToF technology in automotive, consumer electronics, and XR fields to accelerate its growth as an international leader in 3D sensor semiconductor companies.